خانهمحصولاتتجهيزات تعميراتدستگاه تعويض چيپ BGA
  • مرکز تخصصی فروش لپ تاپ، کامپیوتر و تپلت
  • فروش قطعات و لوازم جانبی لپ تاپ
  • عرضه مستقیم مودم اینترنت همراه
  • فروش دستگاه تعویض چیپ

دستگاه تعويض چيپ BGA

 

دستگاه تعویض چیپ فول اتومات ZM-R5860C

 

دارا بودن قابلیت تنظیم سریع و دقیق در سه محور

 

سیستم کنترلی PLC با صفحه نمایش لمسی و امکانات امنیتی و نرم افزاری بالا

 

دارای سه سیستم حرارتی مستقل بالا و پائین

 

دارا بودن کلیه نازل های مورد نیاز بصورت مگنتی و دارای قابلیت چرخش 360 درجه

 

وجود دوربین کیفیت بالا جهت مونیتورینگ و تنظیمات دقیق

 

Product Description

 

BGA Rework Equipment ZM-R5860C Main Features 

1. BGA Rework Equipment ZM-R5860C adopt liner slide which makes X\Y\Z axis all can do precision adjustment or fast positioning, with high positioning accuracy and fast maneuverability. 

2. BGA Rework Equipment ZM-R5860C is of high definition touch screen (Taiwan), PCL control, can save multiple groups profile, password protection and modify function, and can save multiple groups profile, equipped with instant temperature curve analysis function. 

3. There are 3 independent heating areas from top to bottom. The 1st and 2ND are hot-air heaters, the 3rd is IR preheating, temperature controlled within ± 3 ° . Top heater can be adjusted freely, second heater can be adjusted up and down, and the top and the bottom temperature can control many groups and sections of temperature parameters at the same time. The power consumption of the third IR heater can be adjusted. 

4. BGA Rework Equipment ZM-R5860C Offer all kinds of hot-air nozzle, it can rotate 360° C. With magnet, easy to install and change, customized is available. Bottom IR heater ensure an even heat for PCB board. 

5. Choose imported high-precision K-type thermocouple, closed loop control and automatic temperature compensation system, combined PLC module for the precision control of temperature. 

6. BGA Rework Equipment ZM-R5860C use a V-groove equipped with a flexible fixture for PCB positioning to protect the PCB from deformation when heated or cooled, and it can rework for any BGA package size. 
7. BGA Rework Equipment ZM-R5860C's powerful cross-flow fan rapidly cool the PCB board to improve efficiency. Also built-in vacuum pump and external vacuum suction pen, pick up the chips rapidly. 

8. After finish desoldering& soldering, there is an alarming and alarming in advance. 
9. CE certificate, with emergency stop and Automatic power-off protection device when abnormal accident happens, with a double over-heating protection control. 
10. CCD vision system, accurate judgments on the melting process during the BGA soldering and desoldering, provide critical vision.

 

1

Total Power

4700W

2

Top heater

800W

3

Bottom heater

2nd heater 1200W, 3rd IR heater 2700W

4

Power supply

AC220V± 10        50/60Hz

5

dimension

635× 600× 560mm

6

Positioning

V-groove, PCB support can be adjusted in any direction with external universal fixture

7

Temperature control

(K Sensor) closed loop, independent heating, precision within ± 3° c.

8

PCB size

Max 410× 370mmMin 20× 20 mm

9

Electrical selection

Highly sensitive temperature control module+Touch screen (Taiwan)+Delta PLC

10

Weight

40kg